Analysis Guide

Analysis Overview

ezCAM provides a series of analysis modules to check layouts are in line with manufacturing specifications
- Check according to layer types
- Checks over 300 items
- Take assembly and manufacturing into consideration

Surface Analyzer analyzes design errors for surface and symbols and creates a report to list all the findings
Surface Analyzer only provide analysis check, does not change layout content
Required to change line drawn copper surface to surface feature first
For detailed guide, Please refer to Surface Analyzer

Drill Checks analyzes drill layer for design errors and creates a report to list all the findings
Drill Checks only provide analysis check, does not change layout content
For detailed guide, Please refer to Drill Checks

Board Drill Checks analyzes drill hole spacings in board layers and creates a report to list all the findings
Checks spacings for both drill and rout holes in the same layer
Board Drill Checks only provide analysis check, does not change layout content
Prerequisite：
- Drill attribute .drill must be assigned to drill holes, to distinguish PTH/NPTH/Via holes
- Drill and rout layer must be defined in the matrix
For detailed guide, Please refer to Board Drill Checks

Signal Layer Checks analyzes signal layers for design errors and creates a report to list all the findings
Signal Layer Checks only provide analysis check, does not change layout content
For detailed guide, Please refer to Signal Layer Checks

Power/Ground Checks analyzes power/ground layers for design errors and creates a report to list all the findings
Power / Ground Check use different analysis method for positive and negative layers
For thermal pad analysis, thermal pads are required to be in negative layer and drawn with thermal symbols
Power / Ground Checks only provide analysis check, does not change layout content
For detailed guide, Please refer to Power / Ground Checks

Solder Mask Checks analyzes solder mask layers for design errors and creates a report to list all the findings
Solder Mask Checks only provide analysis check, does not change layout content
For detailed guide, Please refer to Solder Mask Checks

Silk Screen Checks analyzes silk screen layers for design errors and creates a report to list all the findings
Silk Screen Checks only provide analysis check, does not change layout content
For detailed guide, Please refer to Silk Screen Checks

Profile Checks analyzes Profile for design errors and creates a report to list all the findings
Profile Checks only provide analysis check, does not change layout content
Step Profile must be defined first
For detailed guide, Please refer to Profile Checks

SMD Summary analyzes SMD pad on outer layers, creates report on SMD land and packages
For detailed guide, Please refer to SMD Summary

Drill Summary analyzes annular rings for drill holes and creates a report to list all the findings
For detailed guide, Please refer to Drill Summary

Rout Layer Checks analyzes rout layers for design errors, specifically for line and arc features, feature with .comp attribute is included.
For detailed guide, Please refer to Rout Layer Checks